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Tracking the Development of Structural Bonding in Composite Repairs during Curing
Tracking the Development of Structural Bonding in Composite Repairs during Curing [1332]
Автор(ы): I. Kressel, Y. Botsev, S. Ronen, M. Tur
Издательство: DEStech Publication, Inc, 439 North Duke Street, 17602, Lancaster Pensylvania, U.S.A.
Количество страниц: 5
Год: 2010
Аннотация[420 КБ] 
Код: 10553
Описание
A novel structural assessment technique for composite bonded repairs of metallic structures is introduced, using embedded fiber optic Bragg sensors. By utilizing the large difference in the thermal expansion coefficients between the composite patch and the Aluminum substrate, the tracking of both the curing process and bonding quality is now made possible for both room and elevated temperature cure adhesives.
Содержание